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Side PLANE Module
Board Specification
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Routing
| Routing Information |
|---|
| Routing completion | 100.00% |
| Connections | 900 |
| Connections routed | 900 |
| Connections remaining | 0 |
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Layer Information
| Layer | Arcs | Pads | Vias | Tracks | Texts | Fills | Regions | ComponentBodies |
|---|
| Top Layer | 0 | 134 | 0 | 273 | 0 | 4 | 109 | 0 |
| Int1 (+28V) | 12 | 0 | 0 | 49 | 0 | 0 | 1 | 0 |
| Int2 (GND) | 12 | 0 | 0 | 49 | 0 | 0 | 1 | 0 |
| Int3 (L2) | 0 | 0 | 0 | 662 | 0 | 0 | 103 | 0 |
| Int4 (+28V) | 12 | 0 | 0 | 49 | 0 | 0 | 1 | 0 |
| Int5 (GNDin) | 12 | 0 | 0 | 49 | 0 | 0 | 1 | 0 |
| Int6 (L3) | 0 | 0 | 0 | 510 | 0 | 0 | 80 | 0 |
| Int7 (GND) | 12 | 0 | 0 | 49 | 0 | 0 | 1 | 0 |
| Int8 (+12V) | 12 | 0 | 0 | 66 | 0 | 0 | 3 | 0 |
| Bottom Layer | 0 | 692 | 0 | 1595 | 0 | 3 | 526 | 0 |
| Mechanical 1 | 3 | 0 | 0 | 1233 | 144 | 0 | 0 | 20 |
| Board Outline | 12 | 0 | 0 | 29 | 0 | 0 | 0 | 0 |
| Mechanical 13 | 32 | 0 | 0 | 1828 | 15 | 0 | 0 | 175 |
| Mechanical 15 | 0 | 0 | 0 | 1100 | 0 | 0 | 18 | 0 |
| Route Guide | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Top Overlay | 17 | 0 | 0 | 302 | 220 | 0 | 0 | 0 |
| Bottom Overlay | 9 | 0 | 0 | 532 | 294 | 0 | 0 | 0 |
| Top Paste | 0 | 0 | 0 | 0 | 0 | 0 | 54 | 0 |
| Bottom Paste | 0 | 0 | 0 | 0 | 0 | 0 | 8 | 0 |
| Top Solder | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Bottom Solder | 0 | 0 | 0 | 0 | 0 | 0 | 16 | 0 |
| Drill Guide | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Keep-Out Layer | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Drill Drawing | 3 | 0 | 0 | 138 | 161 | 0 | 0 | 0 |
| Multi-Layer | 0 | 717 | 797 | 0 | 0 | 0 | 1 | 0 |
| Total | 148 | 1543 | 797 | 8513 | 834 | 7 | 923 | 195 |
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| Drill Pairs | Vias |
|---|
| Top Layer – Bottom Layer | 797 |
| Total | 797 |
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Copper Area
| Layer | Sq.In. | Sq.MM. | Percent of layer |
|---|
| Top Layer | 48.507 | 31294.584 | 90% |
| Int1 (+28V) | 50.674 | 32692.9 | 94% |
| Int2 (GND) | 51.332 | 33117.051 | 95% |
| Int3 (L2) | 3.382 | 2181.826 | 6% |
| Int4 (+28V) | 50.506 | 32584.42 | 93% |
| Int5 (GNDin) | 50.504 | 32583.272 | 93% |
| Int6 (L3) | 11.254 | 7260.309 | 21% |
| Int7 (GND) | 51.332 | 33117.051 | 95% |
| Int8 (+12V) | 50.316 | 32462.163 | 93% |
| Bottom Layer | 46.874 | 30241.342 | 87% |
| Total | 414.681 | 267534.918 | |
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Board Holes
| Non-Plated Hole Size | Pads | Vias |
|---|
| 0mm | 128 | 0 |
| Total | 128 | 0 |
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Board Slots
| Non-Plated Slot Size / Length | Pads |
|---|
| Total | 0 |
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| Plated Slot Size / Length | Pads |
|---|
| 27.559mil / 74.803mil | 4 |
| 27.559mil / 82.677mil | 2 |
| 29.528mil / 47.244mil | 48 |
| 29.528mil / 59.055mil | 24 |
| Total | 78 |
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Board Square Holes
| Non-Plated Square Hole Size | Pads |
|---|
| Total | 0 |
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| Plated Square Hole Size | Pads |
|---|
| Total | 0 |
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Other
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| Pad Pwr/Gnd Expansion | Count |
|---|
| 0.254mm | 1543 |
| Total | 1543 |
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| Pad Relief Conductor Width | Count |
|---|
| 0.508mm | 1543 |
| Total | 1543 |
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| Pad Relief Air Gap | Count |
|---|
| 0.381mm | 1543 |
| Total | 1543 |
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| Pad Relief Entries | Count |
|---|
| 4 | 1543 |
| Total | 1543 |
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| Via Pwr/Gnd Expansion | Count |
|---|
| 0.254mm | 797 |
| Total | 797 |
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| Arc Degrees | Count |
|---|
| 90 | 84 |
| 180 | 19 |
| 360 | 45 |
| Total | 148 |
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| Net Via Size | Count |
|---|
| 0.381mm | 219 |
| Total | 219 |
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